The highly integrated optical image stabilization IC provides an industry-leading, low-power solution for precise suppression control of camera picture vibration and provides effective left-right and up-down adjustment
ON Semiconductor has introduced the industry's highest precision optical image stabilization (OIS) integrated circuit (IC) for smartphone camera modules. The highly integrated LC898111AXB-MH solution delivers industry-leading precision and low energy operation in a compact size.
The LC898111AXB-MH combines the controller and driver functions needed to handle OIS in a smartphone camera module. The significantly improved shutter speed makes exposure compensation far superior to competing OIS schemes. Therefore, it can achieve precise suppression control of camera picture vibration. In addition, it can also be used to achieve the indispensable left and right and up and down adjustment function in the case of walking and shooting. The output of this IC integrated pulse width modulation (PWM) driver reduces power consumption and reduces the impact of noise on image quality. This highly integrated, pre-programmed IC enables engineers to minimize the number of external components required in a system design, thereby reducing total energy consumption and board area occupied.
Tomofumi Watanabe, Head of the Power Solutions Products Business Unit at ON Semiconductor's Smart Power Solutions Division, said: "The need to improve the camera performance of the latest smartphones is increasing as consumers expect better and better camera features. Mobile phone manufacturers need to specify higher resolution CMOS image sensors with higher OIS accuracy. This compact, highly advanced, and energy-efficient single-chip solution helps design smartphones that are lighter, thinner, and more capable. The innovative LC898111AXB-MH IC has already been adopted by leading smartphone manufacturers and is now being used in smartphones with the highest photographic resolution on the market today."
The LC898111AXB-MH has a variety of digital and analog audio processing mechanisms, including a dual-channel position sensing circuit, a gyro filter interface circuit and a lens servo circuit. The position sensing circuit consists of a Hall amplifier circuit, a constant current digital to analog converter (DAC), a gain control operational amplifier, and a 12-bit analog to digital converter (ADC) for each channel. The gyro filter interface circuit is fully compatible with analog and digital signals. The gyro filter interface and the lens servo circuit can be adjusted through the I2C and SPI bus interface to provide various configurations when connecting different gyros and actuators. As a result, the device covers a wider range of flutter frequencies and thus provides a greater image stability Angle.
On Semiconductor plans to expand this product range and is already offering samples of LC898119XC-MH, which is developing the industry's smallest chip size (only 2.0mm X 2.0mm X 0.675mm) and offers extremely low power consumption.