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Sony IMX477 CMOS image sensor chip

IMX477 is a 1/2.3-inch type, using 1.55um single pixel process technology to support total effective pixel 12.3 million video shooting. This new CMOS image sensor also supports Sony's exclusive SME-HDR (Spatially Multiplexed Exposure HDR) and DOL-HDR (Digital Overlap HDR) advanced image processing technologies. In addition, the image sensor can support dual sensor synchronous operation. IMX477 also uses backlit imaging technology to achieve high-quality images in low illumination.

● ਵਿਸ਼ੇਸ਼ਤਾਵਾਂ:

■Backlit stacked CMOS image sensor

■Digital overlap high dynamic range (DOL-HDR) mode with raw data output.

■ ਉੱਚ ਸਿਗਨਲ-ਟੂ-ਆਇਸ ਅਨੁਪਾਤ (SNR)।

■ਪੂਰਾ ਰੈਜ਼ੋਲਿਊਸ਼ਨ @ 60 fps (ਆਮ), 4K2K @ 60 fps (ਆਮ), 1080p @ 240 fps

▲ਪੂਰਾ ਰੈਜ਼ੋਲਿਊਸ਼ਨ @ 40 fps (12-ਬਿੱਟ ਆਮ), ਪੂਰਾ ਰੈਜ਼ੋਲਿਊਸ਼ਨ @ 30 fps

■ RAW12/10/8, COMP8 ਦੇ ਆਉਟਪੁੱਟ ਵੀਡੀਓ ਫਾਰਮੈਟ।

■Power saving mode

■ਪਿਕਸਲ ਬਿਨਿੰਗ ਰੀਡਆਊਟ ਅਤੇ V ਸਬ-ਸੈਪਲਿੰਗ ਫੰਕਸ਼ਨ।

■ ਸੁਤੰਤਰ ਫਲਿੱਪ ਅਤੇ ਸ਼ੀਸ਼ਾ।

■ਇਨਪੁਟ ਕਲਾਕ ਬਾਰੰਬਾਰਤਾ 6 ਤੋਂ 27 MHz

■CSI-2 ਸੀਰੀਅਲ ਡਾਟਾ ਆਉਟਪੁੱਟ (MIPI 2-ਲੇਨ/4-ਲੇਨ, ਅਧਿਕਤਮ 2.1 Gbps/ਲੇਨ, D-PHY ਨਿਰਧਾਰਨ ਸੰਸਕਰਣ 1.2 ਦੇ ਅਨੁਕੂਲ)

■2-ਤਾਰ ਸੀਰੀਅਲ ਸੰਚਾਰ।

■Two PLLs for independent clock generation of pixel control and data output interface.

■Defective pixel correction (DPC)

■Ambient light sensor (ALS)

■Fast mode transition. (On the fly)

■ ਦੋਹਰਾ ਸੈਂਸਰ ਸਮਕਾਲੀ ਕਾਰਵਾਈ (ਮਲਟੀਪਲ ਕੈਮਰਿਆਂ ਦੇ ਅਨੁਕੂਲ)

ਉਪਭੋਗਤਾ ਦੀ ਵਰਤੋਂ ਲਈ ■7 k-bit OTP ROM।

■ਬਿਲਟ-ਇਨ ਤਾਪਮਾਨ ਸੂਚਕ

■10-ਬਿੱਟ/12-ਬਿੱਟ ਔਨ-ਚਿੱਪ A/D ਰੂਪਾਂਤਰਨ

■92-ਪਿੰਨ ਉੱਚ-ਸ਼ੁੱਧਤਾ ਸਿਰੇਮਿਕ ਪੈਕੇਜ

Dogoozx customized IMX477 camera module:

  • Sony IMX477 CMOS image sensor chip插图

    Sony imx 4k 2K ਕੈਮਰਾ ਮੋਡੀਊਲ ਲਈ Dogoozx 8mp 12mp IMX415 IMX377 IMX477 IMX577 Cmos AF FF

  • Sony IMX477 CMOS image sensor chip插图1

    Dogoozx 12MP 4K2K 1080P 240fps video capture WDR IMX577 IMX477 drone camera module MIPI

  • Sony IMX477 CMOS image sensor chip插图2

    The Raspberry Pi high-end camera module is now available

  • IMX477 camera image sensor FAQ

  • 1. What type of image sensor is IMX477?

  • A: IMX477 is a backlit stacking CMOS image sensor using 1.55um single-pixel process technology, with 12.3 million total effective pixels and supports video shooting.

  • 2. What advanced image processing technologies does IMX477 support?

  • A: IMX477 also supports Sony's exclusive SME-HDR (partitioned high dynamic range exposure) and DOL-HDR (digital overlap high dynamic) advanced image processing technologies, which can provide excellent image quality.

  • 3. What are the main performance features of IMX477?

  • A: The main performance features of IMX477 include:

  • High signal-to-noise ratio: up to 60 frames per second at full resolution, supporting 4K2K@60 frames per second and 1080p@240 frames per second shooting.

  • High dynamic range: DOL-HDR mode supports wider dynamic range.

  • Multiple output formats: supports multiple video formats such as raw12/10/8, COMP8.

  • Flexible functions: including independent flip and mirror, fast mode conversion, pixel bin, readout and V sub-sampling functions.

  • Environmental adaptability: built-in ambient light sensor and temperature sensor, supporting dual sensor synchronous operation.

  • 4. In what fields is IMX477 widely used?

  • A: With its excellent performance and special features, IMX477 is widely used in many fields, including but not limited to:

  • Intelligent monitoring: through the collaborative work of multiple sensors, it provides more comprehensive and stable image output.

  • Security system: adapt to complex environments and improve monitoring effects.

  • Unmanned driving: powerful environmental perception capabilities, assisting autonomous driving technology.

  • Smartphone: improve the quality of photo and video recording.

  • Medical imaging: Provide high-resolution image support in the medical field.

  • Aerial photography: Meet the needs of professional photography and capture wonderful moments.

  • 5. What are the packaging methods of IMX477?

  • Answer: The packaging method of IMX477 depends on the specific product design and application scenario. Common packaging methods include:

  • LGA (Land Grid Array): The pins are arranged in a square array with a high pin density.

  • BGA (Ball Grid Array): The pins are arranged in a spherical array, which is easy to manufacture and install.

  • CSP (Chip Scale Package): The pins are directly connected to the chip itself, the package is compact but difficult to manufacture and install.

  • 6. What common problems may IMX477 encounter during use?

  • Answer: The problems that IMX477 may encounter during use include but are not limited to:

  • Image noise: In low-light environments, there may be an increase in noise, which can be improved by adjusting the gain and exposure parameters.

  • Color distortion: Color distortion may occur due to factors such as light and color temperature, which can be corrected by adjusting the white balance.

  • Autofocus problem: Autofocus may be affected by factors such as ambient light and object movement, resulting in inaccurate focus or slow speed.

  • Overheating problem: Long-term use may cause the sensor to overheat, affecting image quality and stability. Pay attention to heat dissipation and temperature control.

  • 7. How to solve the overheating problem of IMX477?

  • Answer: Solving the overheating problem of IMX477 can start from the following aspects:

  • Optimize heat dissipation design: Ensure that there is enough heat dissipation space around the sensor, and use efficient heat dissipation materials and technologies.

  • Control usage time: Avoid long-term continuous use and take a proper rest to reduce the temperature.

  • Adjust the working environment: Try to avoid using it in harsh environments such as high temperature and humidity.

  • Software optimization: Adjust the working state of the sensor through software algorithms to reduce power consumption and heat generation.

ਟੈਗਸ: IMX477
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