Application of laser processing technology in mobile phone camera module

As one of the most important components in the mobile phone, the mobile phone mô-đun máy ảnh has the characteristics of small size, light weight, high integration and high reliability. As smart phones become thinner and thinner, the mobile phone camera module is becoming more and more sophisticated. The connection between the camera and the motherboard is very precise. Therefore, how to process such micro components has become one of the important factors to ensure the quality of mobile phone camera modules. Laser processing technology, as an important tool in the field of micro-precision machining, can process various types of components, especially in the field of mobile phone camera modules.

As a non-contact processing tool, laser can increase high-intensity light energy in a small focus, and can be used to laser cut, drill, mark, weld, scribe and other processing of materials. Because the PCB circuit board in the mobile phone camera module is composed of FR4 and FPC soft and hard board, there are also some use of pure hard board or soft board, so the laser processing technology is not the same, laser cutting technology is mainly for FR4 and FPC, laser marking technology is mainly for FR4 or FPC two-dimensional code laser marking.