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Sony IMX477 CMOS image sensor chip

IMX477 is a 1/2.3-inch type, using 1.55um single pixel process technology to support total effective pixel 12.3 million video shooting. This new CMOS image sensor also supports Sony's exclusive SME-HDR (Spatially Multiplexed Exposure HDR) and DOL-HDR (Digital Overlap HDR) advanced image processing technologies. In addition, the image sensor can support dual sensor synchronous operation. IMX477 also uses backlit imaging technology to achieve high-quality images in low illumination.

●Features:

■Backlit stacked CMOS image sensor

■Digital overlap high dynamic range (DOL-HDR) mode with raw data output.

■High signal-to-noise ratio (SNR).

■Full resolution @ 60 fps (normal), 4K2K @ 60 fps (normal), 1080p @ 240 fps

▲Full resolution @ 40 fps (12-bit normal), full resolution @ 30 fps

■Output video formats of RAW12/10/8, COMP8.

■Power saving mode

■Pixel binning readout and V sub-sampling functions.

■Independent flip and mirror.

■Input clock frequency 6 to 27 MHz

■CSI-2 serial data output (MIPI 2-lane/4-lane, max. 2.1 Gbps/lane, compliant with D-PHY specification version 1.2)

■2-wire serial communication.

■Two PLLs for independent clock generation of pixel control and data output interface.

■Defective pixel correction (DPC)

■Ambient light sensor (ALS)

■Fast mode transition. (On the fly)

■Dual sensor synchronous operation (compatible with multiple cameras)

■7 k-bit OTP ROM for user use.

■Built-in temperature sensor

■10-bit/12-bit on-chip A/D conversion

■92-pin high-precision ceramic package

Dogoozx customized IMX477 camera module:

  • Sony IMX477 CMOS image sensor chip插图

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  • Sony IMX477 CMOS image sensor chip插图1

    Dogoozx 12MP 4K2K 1080P 240fps video capture WDR IMX577 IMX477 drone camera module MIPI

  • Sony IMX477 CMOS image sensor chip插图2

    The Raspberry Pi high-end camera module is now available

  • IMX477 camera image sensor FAQ

  • 1. What type of image sensor is IMX477?

  • A: IMX477 is a backlit stacking CMOS image sensor using 1.55um single-pixel process technology, with 12.3 million total effective pixels and supports video shooting.

  • 2. What advanced image processing technologies does IMX477 support?

  • A: IMX477 also supports Sony's exclusive SME-HDR (partitioned high dynamic range exposure) and DOL-HDR (digital overlap high dynamic) advanced image processing technologies, which can provide excellent image quality.

  • 3. What are the main performance features of IMX477?

  • A: The main performance features of IMX477 include:

  • High signal-to-noise ratio: up to 60 frames per second at full resolution, supporting 4K2K@60 frames per second and 1080p@240 frames per second shooting.

  • High dynamic range: DOL-HDR mode supports wider dynamic range.

  • Multiple output formats: supports multiple video formats such as raw12/10/8, COMP8.

  • Flexible functions: including independent flip and mirror, fast mode conversion, pixel bin, readout and V sub-sampling functions.

  • Environmental adaptability: built-in ambient light sensor and temperature sensor, supporting dual sensor synchronous operation.

  • 4. In what fields is IMX477 widely used?

  • A: With its excellent performance and special features, IMX477 is widely used in many fields, including but not limited to:

  • Intelligent monitoring: through the collaborative work of multiple sensors, it provides more comprehensive and stable image output.

  • Security system: adapt to complex environments and improve monitoring effects.

  • Unmanned driving: powerful environmental perception capabilities, assisting autonomous driving technology.

  • Smartphone: improve the quality of photo and video recording.

  • Medical imaging: Provide high-resolution image support in the medical field.

  • Aerial photography: Meet the needs of professional photography and capture wonderful moments.

  • 5. What are the packaging methods of IMX477?

  • Answer: The packaging method of IMX477 depends on the specific product design and application scenario. Common packaging methods include:

  • LGA (Land Grid Array): The pins are arranged in a square array with a high pin density.

  • BGA (Ball Grid Array): The pins are arranged in a spherical array, which is easy to manufacture and install.

  • CSP (Chip Scale Package): The pins are directly connected to the chip itself, the package is compact but difficult to manufacture and install.

  • 6. What common problems may IMX477 encounter during use?

  • Answer: The problems that IMX477 may encounter during use include but are not limited to:

  • Image noise: In low-light environments, there may be an increase in noise, which can be improved by adjusting the gain and exposure parameters.

  • Color distortion: Color distortion may occur due to factors such as light and color temperature, which can be corrected by adjusting the white balance.

  • Autofocus problem: Autofocus may be affected by factors such as ambient light and object movement, resulting in inaccurate focus or slow speed.

  • Overheating problem: Long-term use may cause the sensor to overheat, affecting image quality and stability. Pay attention to heat dissipation and temperature control.

  • 7. How to solve the overheating problem of IMX477?

  • Answer: Solving the overheating problem of IMX477 can start from the following aspects:

  • Optimize heat dissipation design: Ensure that there is enough heat dissipation space around the sensor, and use efficient heat dissipation materials and technologies.

  • Control usage time: Avoid long-term continuous use and take a proper rest to reduce the temperature.

  • Adjust the working environment: Try to avoid using it in harsh environments such as high temperature and humidity.

  • Software optimization: Adjust the working state of the sensor through software algorithms to reduce power consumption and heat generation.

Tags: IMX477

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